GB/T 48118-2026
UpcomingCeramic copper-clad substrate for power semiconductor modules
- Issued
- 2026-08-28
- Effective
- 2027-03-01
Browse Chinese standards for steel, non-ferrous metals, metal alloys, metallurgy, material properties and metal testing.
Ceramic copper-clad substrate for power semiconductor modules
General technical specification for walk-through metal detector
General technical specification for hand-held metal detector
Measurement method of residual stress in steel plate by magnetic anisotropy
Cylinder valve for non-refillable steel welded cylinder
Steel slag—Determination of carbon and sulfur content
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